此外，国际配售承配人数量为219名，前10大承配人合计获配超2000万股，占国际配售的60.33%，前25大承配人合计占比88.78%。
The new chips are engineered around Apple’s new Fusion Architecture, an advanced design that includes a powerful CPU, scalable GPU, Media Engine, unified memory controller, Neural Engine, and Thunderbolt 5 capabilities.，详情可参考PDF资料
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